Module 1: Physics of Power dissipation in MOSFET devices Need for low power circuit design, MIS Structure, Short channel effects-surface scattering, punch through, velocity saturation, impact ionization Hot electron effects, Drain Induced Barrier Lowering, Deep submicron transistor design issues.
Sources of power dissipation in CMOS-Dynamic Power Dissipation: Charging and Discharging capacitance power dissipation , Short Circuit Power: Short Circuit Current of Inverter , Short circuit current dependency with input and output load , Glitching Power, Static Power Dissipation, Leakage Power Dissipation, Gate level power analysis : Capacitive, internal and Static power dissipation of gate level circuit.
Module 3: Power Reduction Techniques :Supply voltage Scaling Approaches: Multi VDD and Dynamic VDD, leakage power reduction Techniques – Transistor stacking, VTCMOS,MTCMOS, DTCMOS, Power gating, Clock gating for Dynamic power dissipation, Transistor and Gate Sizing for Dynamic and Leakage Power Reduction.